NDLI: Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder

Content Provider	Springer Nature Link
Author	Ochoa, F. Williams, J. J. Chawla, N.
Copyright Year	2003
Abstract	The tensile behavior and microstructure of bulk, Sn-3.5Ag solders as a function of cooling rate were studied. Cooling rate is an important processing parameter that affects the microstructure of the solder and, therefore, significantly influences mechanical behavior. Controlled cooling rates were obtained by cooling specimens in different media: water, air, and furnace. Cooling rate significantly affected secondary dendrite-arm size and spacing of the Sn-rich phase, as well as the aspect ratio of Ag$_{3}$Sn. The Sn-rich dendrite-arm size and spacing were smaller for water-cooled specimens than for air-cooled specimens. Furnace cooling yielded a nearly eutectic microstructure because the cooling rate approached equilibrium cooling. The morphology of Ag$_{3}$Sn also changed from spherical, at a fast cooling rate, to a needlelike morphology for slower cooling. The changes in the microstructure induced by the cooling rate significantly affected the mechanical behavior of the solder. Yield strength was found to increase with increasing cooling rate, although ultimate tensile strength and strain-to-failure seemed unaffected by cooling rate. Cooling rate did not seem to affect Young’s modulus, although a clear coorelation between modulus and porosity was obtained. The mechanical behavior was correlated with the observed microstructure, and fractographic analysis was employed to elucidate the underlying damage mechanisms.
Starting Page	1414
Ending Page	1420
Page Count	7
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	32
Issue Number	12
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2003-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Lead-free solder Sn-3.5Ag cooling rates microstructure tensile behavior Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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