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  1. Journal of Electronic Materials
  2. Journal of Electronic Materials : Volume 37
  3. Journal of Electronic Materials : Volume 37, Issue 4, April 2008
  4. Foreword
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Journal of Electronic Materials : Volume 46
Journal of Electronic Materials : Volume 45
Journal of Electronic Materials : Volume 44
Journal of Electronic Materials : Volume 43
Journal of Electronic Materials : Volume 42
Journal of Electronic Materials : Volume 41
Journal of Electronic Materials : Volume 40
Journal of Electronic Materials : Volume 39
Journal of Electronic Materials : Volume 38
Journal of Electronic Materials : Volume 37
Journal of Electronic Materials : Volume 37, Issue 12, December 2008
Journal of Electronic Materials : Volume 37, Issue 11, November 2008
Journal of Electronic Materials : Volume 37, Issue 10, October 2008
Journal of Electronic Materials : Volume 37, Issue 9, September 2008
Journal of Electronic Materials : Volume 37, Issue 8, August 2008
Journal of Electronic Materials : Volume 37, Issue 7, July 2008
Journal of Electronic Materials : Volume 37, Issue 6, June 2008
Journal of Electronic Materials : Volume 37, Issue 5, May 2008
Journal of Electronic Materials : Volume 37, Issue 4, April 2008
Foreword
Modeling of Magnetic-Field-Assisted Assembly of Semiconductor Devices
Morphology of Thick SiC Epitaxial Films Grown by the Physical Vapor Transport Method
Microwave Performance of AlGaN/GaN High-Electron-Mobility Transistors on Si/SiO$_{2}$/Poly-SiC Substrates
Luminescence of Long-Term Ordered Pure and Doped Gallium Phosphide
Relationship of Band-Edge Luminescence to Recombination Lifetime in Silicon Wafers
Platinum and Rhodium Silicide–Germanide Optoelectronics
Study of Fracture Mechanics in Testing Interfacial Fracture of Solder Joints
Analysis of Barrier Defects in Low-k/Cu Interconnects Based on Electrochemical Response and Simulation Cell
Practical Surface Treatments and Surface Chemistry of n-Type and p-Type GaN
Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability
Temperature Dependence of Electrical and Thermal Conductivities of an Epoxy-Based Isotropic Conductive Adhesive
Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing
Determination of the Elastic Properties of Cu$_{3}$Sn Through First-Principles Calculations
Effect of Oxidation on Indium Solderability
Equi-Axed Grain Formation in Electrodeposited Sn-Bi
Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder
Direct Fabrication of Fine Gold Patterns from an Aqueous Solution by a UV Laser
Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process
Characterization of Ge$_{22}$Sb$_{22}$Te$_{56}$ and Sb-Excess Ge$_{15}$Sb$_{47}$Te$_{38}$ Chalcogenide Thin Films for Phase-Change Memory Applications
Memory Switching Characteristics in Amorphous Ga$_{2}$Se$_{3}$ Films
Journal of Electronic Materials : Volume 37, Issue 3, March 2008
Journal of Electronic Materials : Volume 37, Issue 2, February 2008
Journal of Electronic Materials : Volume 37, Issue 1, January 2008
Journal of Electronic Materials : Volume 36
Journal of Electronic Materials : Volume 35
Journal of Electronic Materials : Volume 34
Journal of Electronic Materials : Volume 33
Journal of Electronic Materials : Volume 32
Journal of Electronic Materials : Volume 31
Journal of Electronic Materials : Volume 30
Journal of Electronic Materials : Volume 29
Journal of Electronic Materials : Volume 28
Journal of Electronic Materials : Volume 27
Journal of Electronic Materials : Volume 26

Foreword

Content Provider Springer Nature Link
Author Ravindra, N.M.
Copyright Year 2008
Starting Page 373
Ending Page 373
Page Count 1
File Format PDF
ISSN 03615235
Journal Journal of Electronic Materials
Volume Number 37
Issue Number 4
e-ISSN 1543186X
Language English
Publisher Springer US
Publisher Date 2008-02-08
Publisher Place Boston
Access Restriction One Nation One Subscription (ONOS)
Subject Keyword Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type Text
Subject Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering
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