NDLI: Study on the property of boron carbide-modified phenol-formaldehyde resin for silicon carbide bonding

Content Provider	Springer Nature Link
Author	Jiang, Haiyun Wang, Jigang Wu, Shenqing Wu, Ruomei Hu, Zhongliang Zhang, Weili Zhao, Xuehui
Copyright Year	2014
Abstract	Boron carbide powder (B$_{4}$C) was added into phenol-formaldehyde (PF) resin to increase the high temperatural bond strength of PF resin. Using the modified PF resin silicon carbide block could be bonded satisfactorily even treated at 700–800°C, and its bond strength was higher than 20 MPa. The thermal modification mechanism was investigated by scanning electron microscopy, energy dispersive X-Ray, and pyrolysis gas chromatography spectrum coupled with a mass spectrum. The results indicate that B$_{4}$C can increase the heat resistance of PF resin efficiently. B$_{4}$C can not only seize some active groups of the resin matrix including phenolic hydroxyl and methylol, but also can hold the main components of some volatiles such as CO, H$_{2}$O, phenol, and its derivations in the resin matrix by chemical reactions. At the same time, the reaction product boron oxide closes and mends the microcracks for its satisfactory wettability and adhesive capacity. In consequence, the efficient components escaping from the resin matrix can be sharply reduced. A relative intact skeleton of the resin is obtained, and its bond strength and thermal stability are remarkably elevated.
Starting Page	904
Ending Page	908
Page Count	5
File Format	PDF
ISSN	10704272
Journal	Russian Journal of Applied Chemistry
Volume Number	87
Issue Number	7
e-ISSN	16083296
Language	English
Publisher	Pleiades Publishing
Publisher Date	2014-10-16
Publisher Place	Moscow
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Chemistry/Food Science Industrial Chemistry/Chemical Engineering
Content Type	Text
Resource Type	Article
Subject	Chemistry Chemical Engineering

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