NDLI: Thermodynamic Properties and Transport Coefficients of CO$

Content Provider	Springer Nature Link
Author	Yang, Aijun Liu, Yang Zhong, Linlin Wang, Xiaohua Niu, Chunping Rong, Mingzhe Han, Guohui Zhang, Youpeng Lu, Yanhui Wu, Yi
Copyright Year	2016
Abstract	This paper presents the calculated values of equilibrium compositions, thermodynamic properties and transport coefficients (viscosity, electrical conductivity and thermal conductivity) for CO$_{2}$–Cu thermal plasmas. With several copper mass proportions, the calculation is performed at temperatures 2000–30,000 K and various pressures 0.1–16 bar. Gibbs free energy minimization is used to determine species compositions and thermodynamic properties and the well-known Chapman–Enskog method is applied to calculating transport properties. Furthermore, great attention is paid to cope with the interactions between all the particles in the determination of collision integrals. The results are illustrated indicating the effect of the copper proportions and pressure on the fundamental properties of CO$_{2}$–Cu thermal plasmas. It can be found that a small quantity of copper (less than 10 %) can significantly modify the charged species densities and electrical conductivity especially at low temperature. While for other properties, the influences can be noticeable only when the copper proportion is above 10 %.
Starting Page	1141
Ending Page	1160
Page Count	20
File Format	PDF
ISSN	02724324
Journal	Plasma Chemistry and Plasma Processing
Volume Number	36
Issue Number	4
e-ISSN	15728986
Language	English
Publisher	Springer US
Publisher Date	2016-04-29
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Thermal plasma Thermodynamics properties Chapman–Enskog method CO$_{2}$–Cu Transport coefficient Inorganic Chemistry Mechanics Characterization and Evaluation of Materials Mechanical Engineering
Content Type	Text
Resource Type	Article
Subject	Chemistry Surfaces, Coatings and Films Condensed Matter Physics Chemical Engineering

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