NDLI: Thermomigration and electromigration in Sn8Zn3Bi solder joints

Content Provider	Springer Nature Link
Author	Gu, X. Yung, K. C. Chan, Y. C. Yang, D.
Copyright Year	2010
Abstract	Individual effect of thermomigration (TM) and combined effect of TM and electromigration (EM) on the microstructural variation in Sn8Zn3Bi was investigated by stressing line-type Au/Ni–P/Cu-Sn8Zn3Bi-Au/Ni–P/Ni solder joints with a 5 × 10$^{3 }$A/cm$^{2}$ alternating current (AC) or direct current (DC) at 110°C. Due to the different thermoelectric characteristics of Cu and Ni wires, a thermal gradient of 196°C/cm could be established across the solder joints according to the finite element simulation. In AC current stressing, there is no EM effect and only TM dominates the migration. Microstructural study shows that Zn atoms migrate towards the lower temperature side during TM. In DC current stressing, it is found that both EM and TM play important roles depending various experimental conditions. And the energy change during the EM and the TM is estimated to be ∆ω$_{em}$ 3.2 × 10$^{−28}$ Joule and ∆ω$_{em}$ 2.2 × 10$^{−28}$ Joule, respectively. Upon different current directions in DC current stressing, there is a counteractive or accelerated effect between TM and EM on Zn migration, resulting different microstructures at the cathode side in the solder joints.
Starting Page	217
Ending Page	222
Page Count	6
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	22
Issue Number	3
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2010-04-18
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Thermomigration and electromigration in Sn58Bi ball grid array solder joints

Electromigration issues in lead-free solder joints

Electromigration in reduced-height solder joints with Cu pillars

Design of solder joints for fundamental studies on the effects of electromigration

Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints

Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress

Electromigration reliability for Al$_{2}$O$_{3}$-reinforced Cu/Sn–58Bi/Cu composite solder joints

Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints

Micromechanical characterization of thermomechanically fatigued lead-free solder joints

Thermomigration and electromigration in Sn8Zn3Bi solder joints

Similar Documents

Thermomigration and electromigration in Sn58Bi ball grid array solder joints

Electromigration issues in lead-free solder joints

Electromigration in reduced-height solder joints with Cu pillars

Design of solder joints for fundamental studies on the effects of electromigration

Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints

Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress

Electromigration reliability for Al$_{2}$O$_{3}$-reinforced Cu/Sn–58Bi/Cu composite solder joints

Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints

Micromechanical characterization of thermomechanically fatigued lead-free solder joints

Thermomigration and electromigration in Sn8Zn3Bi solder joints