NDLI: Formation and evolution of intermetallic compounds between the In-3Ag solder and Cu substrate during soldering

Content Provider	Springer Nature Link
Author	Ma, Yunzhu Luo, Huiting Li, Yongjun Liu, Wensheng Wang, Yikai Huang, Boyun
Copyright Year	2015
Abstract	The formation and growth of intermetallic compounds (IMCs) have an important effect on the reliability of the solder. In this paper, formation and evolution of IMCs between the In-3Ag solder and Cu substrate were systematically explored for different soldering time ranged from 1 to 30 min. The interface soldered for 1 or 2 min was only composed of (Ag,Cu)In$_{2}$ IMCs. When the soldering time extended to 4 min, a new (Cu,Ag)$_{11}$In$_{9}$ IMCs layer appeared under the (Ag,Cu)In$_{2}$ IMCs layer. When the soldering time exceeded 5 min, the (Ag,Cu)In$_{2}$ layer was completely decomposed and replaced by the (Cu,Ag)$_{11}$In$_{9}$ layer. Meanwhile, the growth of (Ag,Cu)In$_{2 }$and (Cu,Ag)$_{11}$In$_{9 }$intermetallic layers during jointing were all diffusion-controlled and the growth rates of them are 0.398 and 0.507 µm$^{2}$/s, respectively. Furthermore, shear strength results showed that the shear strength of solder joints decreased with soldering time extending, and those decrease from 5.64 MPa after soldered for 1 min to 3.07 MPa when the soldering time extended to 30 min. The fracture mode also changed from typical ductile fracture mode to mixed ductile–brittle fracture mode with soldering time extending.
Starting Page	7967
Ending Page	7976
Page Count	10
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	26
Issue Number	10
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2015-07-09
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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