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| Content Provider | Springer Nature Link |
|---|---|
| Author | Gao, Li Yin Li, Cai Fu Wan, Peng Liu, Zhi Quan |
| Copyright Year | 2017 |
| Abstract | Ball shear test was conducted on the SnAgCu/Fe–Ni solder joints, as well as SnAgCu/Cu for comparison after reflow and 150 °C high temperature storage following the industrial JEDEC standards. According to microstructural observation, Fe–Ni UBMs show better diffusion barrier effect than Cu UBM, which form very thin FeSn$_{2}$ or FeSn$_{2}$+(Cu,Ni)$_{6}$Sn$_{5}$ layers at the interface without any Kirkendall voids. With such thin IMC layers, the shear strengths of Fe–Ni solder joints were comparable to Cu solder joints, which are in the range of 6.3–6.4 mg/μm$^{2}$ after reflow and then fall into 4.7–5.1 mg/μm$^{2}$ after 1000 h storage. Statistic observations revealed four kinds of fracture mode among failed solder joints, which are ductile fracture, brittle fracture, UBM fracture and pad lift respectively. The UBM fracture is the most common failure mode for Cu solder joint due to the fast consumption and low mechanical strength of Cu UBM, while the ductile failure takes the majority for Fe–Ni UBMs although it gradually turned into brittle fracture later as the aging time increased. The related mechanism of fracture behavior was also discussed concerning the physical properties of interfacial IMCs. Combining the low IMC growth rate, the comparable shear strength and the ductile fracture mode, Fe–45Ni UBM is superior to Cu UBM on the interfacial reliability of high temperature storage. |
| Starting Page | 8537 |
| Ending Page | 8545 |
| Page Count | 9 |
| File Format | |
| ISSN | 09574522 |
| Journal | Journal of Materials Science: Materials in Electronics |
| Volume Number | 28 |
| Issue Number | 12 |
| e-ISSN | 1573482X |
| Language | English |
| Publisher | Springer US |
| Publisher Date | 2017-03-15 |
| Publisher Place | New York |
| Access Restriction | One Nation One Subscription (ONOS) |
| Subject Keyword | Optical and Electronic Materials Characterization and Evaluation of Materials |
| Content Type | Text |
| Resource Type | Article |
| Subject | Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering |
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