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  1. Journal of Materials Science: Materials in Electronics
  2. Journal of Materials Science: Materials in Electronics : Volume 23
  3. Journal of Materials Science: Materials in Electronics : Volume 23, Issue 7, July 2012
  4. Polycrystalline silicon films fabricated by rapid thermal annealing
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Journal of Materials Science: Materials in Electronics : Volume 28
Journal of Materials Science: Materials in Electronics : Volume 27
Journal of Materials Science: Materials in Electronics : Volume 26
Journal of Materials Science: Materials in Electronics : Volume 25
Journal of Materials Science: Materials in Electronics : Volume 24
Journal of Materials Science: Materials in Electronics : Volume 23
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 12, December 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 11, November 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 10, October 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 9, September 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 8, August 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 7, July 2012
Polycrystalline silicon films fabricated by rapid thermal annealing
Optimization of fabrication conditions of MgB$_{2}$/Fe superconducting tapes using response surface methodology
Fabrication and characterization of nano filler-filled epoxy composites for underfill application
In situ micro-Raman spectroscopic study of laser-induced crystallization of amorphous silicon thin films on aluminum-doped zinc oxide substrate
Electrical properties of hexagonal BaTi$_{1−x }$Fe$_{ x }$O$_{3−δ }$ (x = 0.1, 0.2, 0.3) ceramics with NTC effect
Dielectric and impedance properties of Ba$_{2}$Sr$_{3}$DyTi$_{3}$V$_{7}$O$_{30}$ ceramics
Microwave dielectric properties and microstructures of Nd(Mg$_{0.5−x}$Co$_{x}$Sn$_{0.5}$)O$_{3}$ ceramics
Low temperature synthesis and properties of Mg$_{x}$Zn$_{1−x }$O:Al UV transparent conducting films by ultrasonic spray pyrolysis
A comparative study on hydrostatic pressure response of sensors based on N-doped, B-doped and undoped carbon-sphere poly (vinyl alcohol) composites
Properties of pulse plated SnSe films
Lead-free (Ba$_{0.7}$Ca$_{0.3}$)TiO$_{3}$-Ba(Zr$_{0.2}$Ti$_{0.8}$)O$_{3}$-xwt %CuO ceramics with high piezoelectric coefficient by low-temperature sintering
Low temperature sintering and microwave dielectric properties of 7NiNb$_{2}$O$_{6}$–9TiO$_{2}$ ceramics with CuO addition
The characteristics of transparent conducting Al-doped zinc oxide thin films deposited on polymer substrates
Preparation and characterisation of thickness dependent nano-structured ZnS thin films by sol–gel technique
Reactive templated grain growth and anisotropic electrical properties of (Na$_{0.5}$K$_{0.5}$)NbO$_{3}$ ceramics without sintering aids
Influence of annealing temperature on performance of dye-sensitized TiO$_{2}$ nanorod solar cells
Optical and dielectric properties of poly(vinylacetate)/lead oxide composites
Effect of biocompatible glutathione capping on core–shell ZnS quantum dots
Structural, optical and photoluminescence studies of heavily Mn-doped ZnO nanoparticles annealed under Ar atmosphere
Hydrothermal synthesis and mechanism and property study of La-doped BiFeO$_{3}$ crystallites
Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging
Silver content effect on rheological and electrical properties of silver pastes
Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy
Synthesis and characterization of barium borosilicate glass–Al$_{2}$O$_{3}$ composites
Critical studies to improve service reliability of Sn–Ag–Cu solder joints by thermal treatments
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 6, June 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 5, May 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 4, April 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 3, March 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 2, February 2012
Journal of Materials Science: Materials in Electronics : Volume 23, Issue 1, January 2012
Journal of Materials Science: Materials in Electronics : Volume 22
Journal of Materials Science: Materials in Electronics : Volume 21
Journal of Materials Science: Materials in Electronics : Volume 20
Journal of Materials Science: Materials in Electronics : Volume 19
Journal of Materials Science: Materials in Electronics : Volume 18
Journal of Materials Science: Materials in Electronics : Volume 17
Journal of Materials Science: Materials in Electronics : Volume 16
Journal of Materials Science: Materials in Electronics : Volume 15
Journal of Materials Science: Materials in Electronics : Volume 14
Journal of Materials Science: Materials in Electronics : Volume 13
Journal of Materials Science: Materials in Electronics : Volume 12
Journal of Materials Science: Materials in Electronics : Volume 11
Journal of Materials Science: Materials in Electronics : Volume 10
Journal of Materials Science: Materials in Electronics : Volume 9
Journal of Materials Science: Materials in Electronics : Volume 8

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Polycrystalline silicon films fabricated by rapid thermal annealing

Content Provider Springer Nature Link
Author Zhang, Lei Shen, Honglie You, Jiayi Jiang, Feng Wu, Tianru Tang, Zhengxia
Copyright Year 2012
Abstract Poly-crystalline silicon (poly-Si) films were fabricated by rapid thermal annealing (RTA) of amorphous silicon films which were deposited on quartz by hot wire chemical vapor deposition. An insertion of Cr layer can significantly suppress the peeling of Si films during the RTA process. The effect of RTA parameters on the structural properties of poly-Si films was investigated by Raman spectroscopy, X-ray diffraction and scanning electron microscopy. The results show that the crystallinity of the poly-Si films is increased with the increase of RTA temperature and duration. A sharp peak at about 520 cm$^{−1}$ is observed in the Raman spectra of poly-Si films annealed at 900 and 1,100 °C for 15 s indicating the excellent crystallinity of the poly-Si films fabricated by RTA. Poly-Si films with high crystalline fraction of 97.3 % were obtained by RTA at 1,100 °C for 20 s.
Starting Page 1279
Ending Page 1283
Page Count 5
File Format PDF
ISSN 09574522
Journal Journal of Materials Science: Materials in Electronics
Volume Number 23
Issue Number 7
e-ISSN 1573482X
Language English
Publisher Springer US
Publisher Date 2012-06-15
Publisher Place Boston
Access Restriction One Nation One Subscription (ONOS)
Subject Keyword Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type Text
Resource Type Article
Subject Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering
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