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  1. Journal of Materials Science: Materials in Electronics
  2. Journal of Materials Science: Materials in Electronics : Volume 13
  3. Journal of Materials Science: Materials in Electronics : Volume 13, Issue 10, October 2002
  4. Preparation of insulated metal substrate for MBGA package
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Journal of Materials Science: Materials in Electronics : Volume 28
Journal of Materials Science: Materials in Electronics : Volume 27
Journal of Materials Science: Materials in Electronics : Volume 26
Journal of Materials Science: Materials in Electronics : Volume 25
Journal of Materials Science: Materials in Electronics : Volume 24
Journal of Materials Science: Materials in Electronics : Volume 23
Journal of Materials Science: Materials in Electronics : Volume 22
Journal of Materials Science: Materials in Electronics : Volume 21
Journal of Materials Science: Materials in Electronics : Volume 20
Journal of Materials Science: Materials in Electronics : Volume 19
Journal of Materials Science: Materials in Electronics : Volume 18
Journal of Materials Science: Materials in Electronics : Volume 17
Journal of Materials Science: Materials in Electronics : Volume 16
Journal of Materials Science: Materials in Electronics : Volume 15
Journal of Materials Science: Materials in Electronics : Volume 14
Journal of Materials Science: Materials in Electronics : Volume 13
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 12, December 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 11, November 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 10, October 2002
Electrical conductivity of indium sesquioxide thin film
Electro-optical studies in chemically deposited La/Nd doped (Cd-Pb) S films
Characterization of the metatitanate systems (1−x)BaTiO$_{3}$xNiTiO$_{3}$ and (1−x)BaTiO$_{3}$xZnTiO$_{3}$ obtained by the peroxide method
Field emission characteristics of CNTs synthesized by bias-assisted ICPHFCVD and ICPCVD techniques
Compound semiconductor interfaces obtained by direct wafer bonding in hydrogen or forming gas
Preparation of insulated metal substrate for MBGA package
TiO$_{x}$ interlayer characterization for sol–gel derived Pb(Zr, Ti)O$_{3}$ thin films on titanium foil
Processing characteristics of PTCR ceramics with low sintering temperature
Electrical and optical properties of (Sb$_{2}$Se$_{3}$)$_{2}$ (Sb$_{2}$Te$_{3}$)$_{1}$ thin films
Studies on buried layer resistors
Monolithic Integration of III-V optical interconnects on Si using SiGe virtual subtrates
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 9, September 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 8, August 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 7, July 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 6, June 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 5, May 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 4, April 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 3, March 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 2, February 2002
Journal of Materials Science: Materials in Electronics : Volume 13, Issue 1, January 2002
Journal of Materials Science: Materials in Electronics : Volume 12
Journal of Materials Science: Materials in Electronics : Volume 11
Journal of Materials Science: Materials in Electronics : Volume 10
Journal of Materials Science: Materials in Electronics : Volume 9
Journal of Materials Science: Materials in Electronics : Volume 8

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Preparation of insulated metal substrate for MBGA package

Content Provider Springer Nature Link
Author Zhu, Jiman Liu, Yudong Guo, Liquan Ma, Jusheng Mu, Daobin
Copyright Year 2002
Abstract An anodizing technique was employed to prepare insulated metal substrates (IMS) for BGA package in this study. The insulating anodic films of aluminum that were chosen as the substrate were studied with different anodizing processes. A multiple-anodizing process improved the characteristics of IMS, including insulating and thermal performances. BGA packages were achieved on the IMS through electroless plating, electroplating, and photolithography methods.
Starting Page 597
Ending Page 600
Page Count 4
File Format PDF
ISSN 09574522
Journal Journal of Materials Science: Materials in Electronics
Volume Number 13
Issue Number 10
e-ISSN 1573482X
Language English
Publisher Kluwer Academic Publishers
Publisher Date 2002-01-01
Publisher Place Boston
Access Restriction One Nation One Subscription (ONOS)
Subject Keyword Optical and Electronic Materials Characterization and Evaluation Materials
Content Type Text
Resource Type Article
Subject Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering
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