NDLI: Influence of minor Bi additions on the interfacial morphology between Sn–Zn

Content Provider	Springer Nature Link
Author	Chen, Jie Shen, Jun Min, Dong Peng, Changfei
Copyright Year	2008
Abstract	The influence of minor Bi additions on the interfacial morphology between Sn–Zn–xBi (x = 0, 1, 3) solders and a Cu layer after reflowing were investigated by microstructural observations. The addition of minor amount of Bi into Sn–Zn solder reduced the tendency to form cracks at the solder/Cu interface. This is because alloying with Bi reduced the mismatch of the coefficient of thermal expansion (CTE) between the solder alloys and the Cu plate. Moreover, the Sn–Zn solder with Bi reduced the melting temperature of the solder alloy, and, this resulted in the coarsening of the gains and thickening of the intermetallic compound (IMC) layers because solder alloys with a lower melting temperature experienced a longer molten period during reflow. Because the Bi atoms accumulated at the surface of the IMC layers in homogeneously, partially impeding the IMC dissolving into the molten solder, a serrated-like Cu–Zn–Sn IMC layer was formed at the Sn–8Zn–3Bi/Cu interface.
Starting Page	1112
Ending Page	1117
Page Count	6
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	20
Issue Number	11
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2008-12-13
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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