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  1. Journal of Materials Science: Materials in Electronics
  2. Journal of Materials Science: Materials in Electronics : Volume 18
  3. Journal of Materials Science: Materials in Electronics : Volume 18, Issue 10, October 2007
  4. Behavior of ultra fine silver-BaTiO3 composite powders at sintering
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Journal of Materials Science: Materials in Electronics : Volume 28
Journal of Materials Science: Materials in Electronics : Volume 27
Journal of Materials Science: Materials in Electronics : Volume 26
Journal of Materials Science: Materials in Electronics : Volume 25
Journal of Materials Science: Materials in Electronics : Volume 24
Journal of Materials Science: Materials in Electronics : Volume 23
Journal of Materials Science: Materials in Electronics : Volume 22
Journal of Materials Science: Materials in Electronics : Volume 21
Journal of Materials Science: Materials in Electronics : Volume 20
Journal of Materials Science: Materials in Electronics : Volume 19
Journal of Materials Science: Materials in Electronics : Volume 18
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 12, December 2007
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 11, November 2007
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 10, October 2007
Structural and electrical properties of Ba(Fe$_{1/3}$Nb$_{1/3}$Ta$_{1/3}$)O$_{3}$ perovskite
The effect of fumed silica in the polymer gel electrolyte on the cycle efficiency of lithium deposition/striping process
Copper nitride films deposited by dc reactive magnetron sputtering
The size effect in current–voltage characteristic of VO$_{2}$-based ceramics in the on-state
Studies on electrosynthesized zinc mercury selenide alloys
Effect of LP-buffer on the structure of ZnO thin films prepared on glass substrate using RF magnetron sputtering
High transmittance–low resistivity cadmium oxide films grown by reactive pulsed laser deposition
Behavior of ultra fine silver-BaTiO3 composite powders at sintering
A new binderless thick-film piezoelectric paste
Structural and magnetic studies of CTAC-assisted NiZn ferrite films by spray deposition
Effect of substrate on hydrogen in and out diffusion from a-Si:H thin films
Direct robust bonding between Sn-based solder and Si substrate
Magnetic properties of Nd-Y$_{3}$Fe$_{5}$O$_{12}$ nanoparticles
Room-temperature indentation creep of lead-free Sn–Bi solder alloys
Stress reduction during phase change in Ge$_{2}$Sb$_{2}$Te$_{5}$ by capping TiN film
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 1, Supplement,October 2007
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 9, September 2007
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 8, August 2007
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 7, July 2007
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 6, June 2007
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 5, May 2007
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 4, April 2007
Journal of Materials Science: Materials in Electronics : Volume 18, Issue 1-3, March 2007
Journal of Materials Science: Materials in Electronics : Volume 17
Journal of Materials Science: Materials in Electronics : Volume 16
Journal of Materials Science: Materials in Electronics : Volume 15
Journal of Materials Science: Materials in Electronics : Volume 14
Journal of Materials Science: Materials in Electronics : Volume 13
Journal of Materials Science: Materials in Electronics : Volume 12
Journal of Materials Science: Materials in Electronics : Volume 11
Journal of Materials Science: Materials in Electronics : Volume 10
Journal of Materials Science: Materials in Electronics : Volume 9
Journal of Materials Science: Materials in Electronics : Volume 8

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Behavior of ultra fine silver-BaTiO3 composite powders at sintering

Content Provider Springer Nature Link
Author Songping, Wu
Copyright Year 2007
Abstract In this paper, the metal–ceramic composite material, i.e., silver–BaTiO3 composite powder, was prepared with chemical deposition method. Composition, dispersibility and shape of powder particles were investigated by XRD, SEM and size distribution analyzer. Coalescence of particles occurs during low sintering process, and sintering temperature has a great effect on composition and shape of single powder particles. The sintering of silver on the surface of particles increases with an increasing temperature by SEM and EDX observation. The shrinkage and softening temperature of composite powders increase and decrease as an increasing silver content, respectively, by TMA analysis. Sheet resistance 52 mΩ/□ was observed from the film corresponding to 80 wt.% silver content which was sintered at 300 °C.
Starting Page 1031
Ending Page 1035
Page Count 5
File Format PDF
ISSN 09574522
Journal Journal of Materials Science: Materials in Electronics
Volume Number 18
Issue Number 10
e-ISSN 1573482X
Language English
Publisher Kluwer Academic Publishers-Plenum Publishers
Publisher Date 2007-03-02
Publisher Place New York
Access Restriction One Nation One Subscription (ONOS)
Subject Keyword Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type Text
Resource Type Article
Subject Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering
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