NDLI: Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints

Content Provider	Springer Nature Link
Author	Choi, S. Lucas, J. P. Subramanian, K. N. Bieler, T. R.
Copyright Year	2000
Abstract	Single shear lap joints were made by soldering two Cu substrates with eutectic Sn-Ag solder, and its composite solders containing FeSn/FeSn$_{2}$ or Ni$_{3}$Sn$_{2}$ intermetallic particles introduced by an in-situ method. Ageing of solder joints was performed at 70, 100, 120, 150, 180 °C for 1400 h. The growth of the interfacial intermetallic compound (IMC) layers was characterized assuming diffusion-controlled growth kinetics. Effects of such FeSn/FeSn$_{2}$ and Ni$_{3}$Sn$_{4}$ particulates on the IMC layer growth rate were extensively characterized. Composite solder joints in the fabricated condition formed thinner IMC layers compared to the corresponding non-composite solder joints. The Cu$_{6}$Sn$_{5}$ IMC layer grew faster at temperatures above 120 °C (T/T $_{m}$=0.8), while growing slower at temperatures below 120 °C in composite solder joints. In-situ introduced FeSn/FeSn$_{2}$ and Ni$_{3}$Sn$_{4}$ particle reinforcements in composite solder joints proved effective in reducing the overall growth of the interfacial Cu$_{6}$Sn$_{5}$ IMC layer only at lower temperatures. Composite solder joints exhibited slower growth of the Cu$_{3}$Sn layer during ageing at all temperatures used in this study. Two different regions having different activation energies depending on the temperature were identified for the growth of Cu$_{6}$Sn$_{5}$ and Cu$_{3}$Sn IMC layers. © 2000 Kluwer Academic Publishers
Starting Page	497
Ending Page	502
Page Count	6
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	11
Issue Number	6
e-ISSN	1573482X
Language	English
Publisher	Kluwer Academic Publishers
Publisher Date	2000-01-01
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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