NDLI: Preparation and properties of siloxane polyimide films containing silver nanoparticles and microparticles as conducting adhesive films

Content Provider	Springer Nature Link
Author	Morita, Miru Kuwahara, Yutaka Goto, Motobu
Copyright Year	2010
Abstract	Electrically conducting adhesive films containing silver nanosized particles (AgNPs) were prepared using siloxane polyimide resin (SPI), and their physical properties were investigated. AgNPs with diameters of ca. 6 nm were prepared using oleylamine as a stabilizer. A mixture of the AgNPs and SPI was vigorously stirred, and cast on a polyethylene terephthalate support. Films were then fabricated using a doctor blade method. The heat resistance of the SPI film containing 60 wt% AgNPs was 35 °C higher than that of the SPI film without AgNPs. In addition, epoxy composite SPIAg (Epo-SPIAg) films containing a mixture of AgNPs and micro-sized silver flakes were prepared. Inclusion of AgNPs in these films strengthened their adhesion to silicon or bismaleimide triazine resin substrates. The glass transition temperature of the Epo-SPIAg films containing AgNPs was slightly higher than that of the film containing only micro-sized silver flakes.
Starting Page	531
Ending Page	537
Page Count	7
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	22
Issue Number	5
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2010-08-12
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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