NDLI: High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys

Content Provider	Springer Nature Link
Author	Ali, Bakhtiar Sabri, Mohd Faizul Mohd Said, Suhana Mohd Sukiman, Nazatul Liana Jauhari, Iswadi Soin, rhayati
Copyright Year	2017
Abstract	In this paper, the impact performance of the novel Fe and Bi added Sn-1Ag-0.5Cu solders has been thoroughly evaluated under severe thermal aging at 200 °C temperature for 100, 200 and 300 h. Impact absorbed energy was determined using Charpy impact testing machine having a 5.4 m/s impact speed. The impact absorbed energy increased from 8.1 to 9.7 J with 0.05 wt.% Fe and 1 wt.% Bi addition to SAC105, raising by about 20%. With the increase in Bi content, the impact energy of the alloy did not further increase. The changes in the impact absorbed energies were corroborated by the corresponding modulus of toughness. Microstructure study via optical microscopy as well as field emission scanning electron microscopy showed that Bi reduces the sizes of the β-Sn dendrites as well as IMCs particles (Ag$_{3}$Sn and Cu$_{6}$Sn$_{5)}$ and, thereby, strengthens the alloy. These microstructural modifications improve the strength but decrease the ductility and, as a result, influence the impact toughness of the alloys. The microstructures of Fe and Bi added SAC105 solder alloys showed better stability than SAC105 during high thermal aging due to the Fe and Bi presence in the solder, which then led to their mechanical stability during severe thermal aging.
Starting Page	7277
Ending Page	7285
Page Count	9
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	28
Issue Number	10
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2017-02-04
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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