NDLI: Structural and morphological investigations on DC-magnetron-sputtered nickel films deposited on Si (100)

Content Provider	Springer Nature Link
Author	Geetha Priyadarshini, B. Aich, S. Chakraborty, M.
Copyright Year	2010
Abstract	Pure nickel thin films were deposited on Si (100) substrates under different conditions of sputtering using direct current magnetron sputtering from a nickel metal target. The different deposition parameters employed for this study are target power, argon gas pressure, substrate temperature and substrate-bias voltage. The films exhibited high density of void boundaries with reduction in <111> texture deposited under high argon gas pressures. At argon gas pressure of 5 mTorr and target power of 300 W, Ni deposition rate was ~40 nm/min. In addition, coalescence of grains accompanied with increase in the film texture was observed at high DC power. Ni films undergo morphological transition from continuous, dense void boundaries to microstructure free from voids as the substrate-bias voltage was increased from −10 to −90 V. Furthermore, as the substrate temperature was increased, the films revealed strong <111> fiber texture accompanied with near-equiaxed grain structure. Ni films deposited at 770 K showed the layer-by-layer film formation which lead to dense, continuous microstructure with increase in the grain size.
Starting Page	2860
Ending Page	2873
Page Count	14
File Format	PDF
ISSN	00222461
Journal	Journal of Materials Science
Volume Number	46
Issue Number	9
e-ISSN	15734803
Language	English
Publisher	Springer US
Publisher Date	2010-12-16
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Polymer Sciences Materials Science Characterization and Evaluation of Materials Mechanics Crystallography Continuum Mechanics and Mechanics of Materials
Content Type	Text
Resource Type	Article
Subject	Ceramics and Composites Mechanics of Materials Mechanical Engineering Polymers and Plastics

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