NDLI: Rapid penetration of bismuth from solid Bi$_{2}$Te$_{3}$ along grain boundaries in Cu and Cu-based alloys

Content Provider	Springer Nature Link
Author	Zhevnenko, S. N. Vagav, D. V. Gershman, E. I.
Copyright Year	2011
Abstract	As well known, bismuth rapidly penetrates into copper grain boundaries at about 550 °C and embrittles copper. In the experiments, the authors have used solid Bi$_{2}$Te$_{3}$ for the embrittlement of pure copper and copper-based solid solutions containing iron and silver. The investigated alloys were heated in the closed volume together with Bi$_{2}$Te$_{3}$ for a short time (5–90 min) at 570 °C in the hydrogen atmosphere. Bi$_{2}$Te$_{3}$ did not contact with copper samples during annealing. After that, the samples were bent and grain boundary cracks were formed (with the depth about 10–500 μm). Experiment showed that silver accelerates the embrittlement in the contrast to iron. The cracks in the silver–copper alloys were deeper than in the iron–copper ones. It was assumed that the depth of cracks is equal to the penetration depth. The reasons for this phenomenon were discussed in terms of the impurities effect on the grain boundary segregation.
Starting Page	4248
Ending Page	4253
Page Count	6
File Format	PDF
ISSN	00222461
Journal	Journal of Materials Science
Volume Number	46
Issue Number	12
e-ISSN	15734803
Language	English
Publisher	Springer US
Publisher Date	2011-01-21
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Materials Science Mechanics Characterization and Evaluation of Materials Crystallography Continuum Mechanics and Mechanics of Materials Polymer Sciences
Content Type	Text
Resource Type	Article
Subject	Ceramics and Composites Mechanics of Materials Mechanical Engineering Polymers and Plastics

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Effect of the thickness of Bi–Te compound and Cu electrode on the resultant Seebeck coefficient in touching Cu/Bi–Te/Cu composites

Enhancement of the generating power in Cu/Bi–Te/Cu composite thermoelectric devices

Enhancement of the thermoelectric figure of merit in p- and n-type Cu/Bi-Te/Cu composites

Temperature dependence of the local Seebeck coefficient near the boundary in touching Cu/Bi–Te/Cu composites

Power generation of the touching Cu/Bi-Te/Cu composites under the periodically alternating temperature gradients

Enhancement of the Seebeck coefficient in touching M/Bi–Te/M (M = Cu and Ni) composites

Apparently complete grain boundary wetting in Cu–In alloys

Grain size evolution in Cu-based shape memory alloys

Non-coherent Cu grain boundaries driven by continuous vacancy loading

Rapid penetration of bismuth from solid Bi$_{2}$Te$_{3}$ along grain boundaries in Cu and Cu-based alloys

Similar Documents

Effect of the thickness of Bi–Te compound and Cu electrode on the resultant Seebeck coefficient in touching Cu/Bi–Te/Cu composites

Enhancement of the generating power in Cu/Bi–Te/Cu composite thermoelectric devices

Enhancement of the thermoelectric figure of merit in p- and n-type Cu/Bi-Te/Cu composites

Temperature dependence of the local Seebeck coefficient near the boundary in touching Cu/Bi–Te/Cu composites

Power generation of the touching Cu/Bi-Te/Cu composites under the periodically alternating temperature gradients

Enhancement of the Seebeck coefficient in touching M/Bi–Te/M (M = Cu and Ni) composites

Apparently complete grain boundary wetting in Cu–In alloys

Grain size evolution in Cu-based shape memory alloys

Non-coherent Cu grain boundaries driven by continuous vacancy loading

Rapid penetration of bismuth from solid Bi$_{2}$Te$_{3}$ along grain boundaries in Cu and Cu-based alloys