NDLI: Deformation and fracture behavior of electrocodeposited alumina nanoparticle/copper composite films

Content Provider	Springer Nature Link
Author	Gan, Yong X. Wei, Chih Shing Lam, Marca Wei, Xiaoding Lee, Dongyun Kysar, Jeffrey W. Chen, Xi
Copyright Year	2006
Abstract	Electrocodeposition of alumina nanoparticles and copper thin film on silicon wafers was performed. The volume fraction of the nanoparticle is about 5% and the size is about 50 nm. Comparison between the static tensile behaviors of specimens with and without nanoparticles reveals that the Young’s modulus is significantly increased by incorporating nanoparticles into the copper film. However, the ultimate tensile strength of the nanocomposite (235 MPa) is slightly lower than that of the pure copper reference specimen (250 MPa). For the nanocomposite, the strain at failure is 7.8%, which is lower than that of the pure copper film (10.5%). Distinct microscale deformation mechanisms are observed: the main deformation mechanism of the pure copper film is slip followed by strain hardening, whereas for the nanocomposite, multistage failure behaviors are found due to the debonding at the nanoparticle/copper interface. Notched specimens were also tested and compared with the unnotched specimens. In addition, cyclic loading tests on the nanocomposite were conducted to show its hardening behavior.
Starting Page	5256
Ending Page	5263
Page Count	8
File Format	PDF
ISSN	00222461
Journal	Journal of Materials Science
Volume Number	42
Issue Number	13
e-ISSN	15734803
Language	English
Publisher	Kluwer Academic Publishers-Plenum Publishers
Publisher Date	2007-01-31
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Mechanics Crystallography Continuum Mechanics and Mechanics of Materials Polymer Sciences Characterization and Evaluation of Materials Materials Science
Content Type	Text
Resource Type	Article
Subject	Ceramics and Composites Mechanics of Materials Mechanical Engineering Polymers and Plastics

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