NDLI: A Test-Ordering Based Temperature-Cycling Acceleration Technique for 3D Stacked ICs

Content Provider	Springer Nature Link
Author	Aghaee, Nima Peng, Zebo Eles, Petru
Copyright Year	2015
Abstract	In a modern three-dimensional integrated circuit (3D IC), vertically stacked dies are interconnected using through silicon vias. 3D ICs are subject to undesirable temperature-cycling phenomena such as through silicon via protrusion as well as void formation and growth. These cycling effects that occur during early life result in opens, resistive opens, and stress induced carrier mobility reduction. Consequently these early-life failures lead to products that fail shortly after the start of their use. Artificially-accelerated temperature cycling, before the manufacturing test, helps to detect such early-life failures that are otherwise undetectable. A test-ordering based temperature-cycling acceleration technique is introduced in this paper that integrates a temperature-cycling acceleration procedure with pre-, mid-, and post-bond tests for 3D ICs. Moreover, it reduces the need for costly temperature chamber based temperature-cycling acceleration methods. All these result in a reduction in the overall test costs. The proposed method is a test-ordering and schedule based solution that enforces the required temperature cycling effect and simultaneously performs the tests whenever appropriate. Experimental results demonstrate the efficiency of the proposed technique.
Starting Page	503
Ending Page	523
Page Count	21
File Format	PDF
ISSN	09238174
Journal	Journal of Electronic Testing
Volume Number	31
Issue Number	5-6
e-ISSN	15730727
Language	English
Publisher	Springer US
Publisher Date	2015-11-16
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Temperature cycling test Test scheduling Test ordering 3D stacked IC Circuits and Systems Electrical Engineering Computer-Aided Engineering (CAD, CAE) and Design
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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