NDLI: Piezoelectric actuator design for ultrasonically assisted deep hole drilling

Content Provider	Springer Nature Link
Author	Potthast, C. Eisseler, R. Klotz, D. Wallaschek, J. Heisel, U.
Copyright Year	2007
Abstract	From different chipping machining processes it is known that a superposition of the cutting kinematics with additional vibration energy increases material removal rate and tool life. Concerning the deep drilling process in the scope of smallest diameters from 0.9 to 6 mm insights to this so called hybrid processes are still awaited. Preliminary investigations indicated that here is high, so far unused potential. The goal of current research is an increase in effectiveness of the deep hole drilling process by superimposing additional vibration energy in ultrasonic frequency range by means of a piezoelectric transducer and low-frequency vibrations in the range of acoustic frequencies as well. Positive effects can appear in a couple of areas, e.g. achievable surface quality, feeding force, drilling torque, shape and length of chips, feasibility of machining ceramic materials and tool wear. This paper describes mainly the ultrasound conform design of the vibration unit. Furthermore issues of contactless energy transfer into a rotating tool and model based design of piezoelectric transducers will be addressed.
Starting Page	187
Ending Page	192
Page Count	6
File Format	PDF
ISSN	13853449
Journal	Journal of Electroceramics
Volume Number	20
Issue Number	3-4
e-ISSN	15738663
Language	English
Publisher	Springer US
Publisher Date	2007-05-04
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Deep hole drilling Ultrasonically assisted machining Superimposed vibrations Model based design of piezoelectric transducers Crystallography Electrochemistry Characterization and Evaluation of Materials Ceramics, Glass, Composites, Natural Methods Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Ceramics and Composites Materials Chemistry Mechanics of Materials Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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