NDLI: Response surface analysis to evaluate the influence of deposition parameters on the electrodeposition of Cu

Content Provider	Springer Nature Link
Author	Silva, F. L. G. Garcia, J. R. Cruz, V. G. M. Luna, A. S. Lago, D. C. B. Senna, L. F.
Copyright Year	2008
Abstract	Copper–cobalt alloy coatings were deposited on mild steel substrates using sodium citrate electrolytes at room temperature and under direct current. A set of cathodic polarization curves was plotted by varying the mechanical stirring speed of the solution (0–400 rpm), using a range of current densities during the electrodeposition experiments. Factorial design was used to verify the influence of these deposition parameters on the cathodic efficiency, the copper and cobalt content in the coating, the corrosion current density of the coating/substrate system, and the efficiency of the coating in protecting the substrate. The electroplating experiments showed that, with the studied bath composition, high stirring speed and low current density lead to greater cathodic current efficiency and copper-rich coatings. On the other hand, high current density and low stirring speed yields coatings with high cobalt content and a lower cathodic efficiency. Our results show that the studied parameters affect the corrosion current density and the coating efficiency of the coating/substrate system in opposite ways. The best results were obtained increasing the current density and decreasing the mechanical stirring speed. Additionally, three samples were produced in selected deposition conditions. The coatings morphologies were compact, and their grain sizes seemed to enlarge with increasing stirring speed and decreasing current density.
Starting Page	1763
Ending Page	1769
Page Count	7
File Format	PDF
ISSN	0021891X
Journal	Journal of Applied Electrochemistry
Volume Number	38
Issue Number	12
e-ISSN	15728838
Language	English
Publisher	Springer Netherlands
Publisher Date	2008-07-18
Publisher Place	Dordrecht
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Electroplating Copper Cobalt Response surface methodology Industrial Chemistry/Chemical Engineering Physical Chemistry Electrochemistry
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Chemical Engineering Electrochemistry

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