NDLI: Fatigue fracture of SnAgCu solder joints by microstructural modeling

Content Provider	Springer Nature Link
Author	Erinc, M. Assman, T. M. Schreurs, P. J. G. Geers, M. G. D.
Copyright Year	2008
Abstract	The ongoing miniaturization trend in the microelectronic industry enforces component sizes to approach the micron, or even the nano scale. At these scales, the underlying microstructural sizes and the geometrical dimensions are comparable. The increasing influence of microscopic entities on the overall mechanical properties makes conventional continuum material models more and more questionable. In this study, the thermomechanical reliability of lead-free BGA solder balls is investigated by microstructural modeling. Microstructural input is provided by orientation imaging microscopy (OIM), converted into a finite element framework. Blowholes in BGA solder balls are examined by optical microscopy and a statistical analysis on their size, position and frequency is conducted. Combining the microstructural data with the appropriate material models, three dimensional local models are created. The fatigue life of the package is determined through a critical solder ball. The thermomechanical reliability of the local models are predicted using cohesive zone based fatigue damage models. The simulation results are validated by statistical analyses provided by the industry.
Starting Page	37
Ending Page	49
Page Count	13
File Format	PDF
ISSN	03769429
Journal	International Journal of Fracture
Volume Number	152
Issue Number	1
e-ISSN	15732673
Language	English
Publisher	Springer Netherlands
Publisher Date	2008-10-21
Publisher Place	Dordrecht
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Lead free Cohesive zone modeling Solder fatigue Microstructural modeling Mechanical Engineering Automotive and Aerospace Engineering, Traffic Civil Engineering Mechanics Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Computational Mechanics Modeling and Simulation

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