NDLI: Moisture-induced stresses in engineered wood flooring with OSB substrate

Content Provider	Springer Nature Link
Author	Barbuta, Costel Blanchet, Pierre Cloutier, Alain Deteix, Jean Fortin, André
Copyright Year	2012
Abstract	Engineered wood flooring (EWF) is a multilayer composite flooring product. The cross layered structure is designed to give good dimensional stability to the EWF under changing environmental conditions. However, during winter season in North America, the indoor relative humidity could decrease dramatically and generate an important cupping deformation. The main objective of this study was to characterize the interlaminar stresses (σ 33, σ 13 and σ 23) distribution at free-edges in EWF made with an OSB substrate. A three-dimensional (3D) finite element model was used to predict the cupping deformation and to characterize stresses developed in the EWF. The finite element model is based on an unsteady-state moisture transfer equation, a mechanical equilibrium equation and an elastic constitutive law. The physical and mechanical properties of OSB substrate were experimentally determined as a function of the density and moisture content. The simulated EWF deformations were compared against the laboratory observations. For both simulation and experimental results, the cupping deformation of EWF was induced by varying the ambient relative humidity from 50 to 20% at 20°C. A good agreement has been found between the numerical and experimental EWF cupping deformation. The stress distribution fields generated by the model correspond to the delaminations observed on the OSB substrate in the climate room. Delamination in EWF can occur principally under the action of the tension stress or a combination of tension and shear stresses. Finally, simulated results show that the levels of interlaminar stresses are maximal near the free-edges of EWF strips.
Starting Page	327
Ending Page	335
Page Count	9
File Format	PDF
ISSN	14350211
Journal	Journal of Wood Science
Volume Number	58
Issue Number	4
e-ISSN	16114663
Language	English
Publisher	Springer Japan
Publisher Date	2012-03-08
Publisher Place	Japan
Access Restriction	Subscribed
Subject Keyword	Layered structure Delamination Finite element analysis (FEA) Wood testing Characterization and Evaluation of Materials Materials Science Wood Science & Technology
Content Type	Text
Resource Type	Article
Subject	Biomaterials Forestry

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Moisture-induced stresses in engineered wood flooring with OSB substrate

Study of visual evaluations for wood flooring applying fuzzy logic

Finite element modeling (FEM) simulation of interactions between wood and microwaves

Three-dimensional finite element analysis of the Japanese traditional post-and-beam connection

Modeling and characterization of the moisture-dependent bilinear behavior of regenerated cellulose composites

Sensitivity study of the finite element model for wood-framed shear walls

Parameter estimation of moisture diffusivity in wood by an inverse method

Vibrational properties of harp soundboard with respect to its multi-layered structure

Bending creep behavior of wood under cyclic moisture changes

Moisture-induced stresses in engineered wood flooring with OSB substrate

Similar Documents

Moisture-induced stresses in engineered wood flooring with OSB substrate

Study of visual evaluations for wood flooring applying fuzzy logic

Finite element modeling (FEM) simulation of interactions between wood and microwaves

Three-dimensional finite element analysis of the Japanese traditional post-and-beam connection

Modeling and characterization of the moisture-dependent bilinear behavior of regenerated cellulose composites

Sensitivity study of the finite element model for wood-framed shear walls

Parameter estimation of moisture diffusivity in wood by an inverse method

Vibrational properties of harp soundboard with respect to its multi-layered structure

Bending creep behavior of wood under cyclic moisture changes

Moisture-induced stresses in engineered wood flooring with OSB substrate