NDLI: Bending strength and internal bond strength of wood-based boards subjected to various exposure conditions

Content Provider	Springer Nature Link
Author	Korai, Hideaki Kojima, Yoichi Suzuki, Shigehiko
Copyright Year	2015
Abstract	Phenol–formaldehyde resin-bonded particleboard (PF board), methylene diphenyl diisocyanate resin-bonded particleboard (MDI board), aspen oriented strand board (aspen board), Scots pine oriented strand board (pine board), methylene diphenyl diisocyanate resin-bonded medium-density fiberboard (F-MDI board), and melamine–urea–formaldehyde resin-bonded medium-density fiberboard (F-MUF board)—six board types overall—were subjected to high relative humidity (90 %, 20 °C) or cyclic humidity of high/low relative humidity (90/45 %, 20 °C) for 5 years. The PF board and aspen board showed reduction in bending strength [modulus of rupture (MOR)] and internal bond strength (IB); however, the MDI board, pine board, F-MDI board, and F-MUF board showed almost no reduction. Furthermore, the boards were subjected to outdoor exposure and Test B (boiling for 2 h) from the Japanese Industrial Standard (JIS); the results showed large reduction in the MOR and IB of the PF board and aspen board. In contrast, outdoor exposure did not greatly reduce the MOR and IB of the F-MUF board and F-MDI board. Although the IB of the F-MUF board reduced after the JIS Test B because of using low-durability resin, the IB retention was as high as 87.8 % for 5-year outdoor exposure.
Starting Page	500
Ending Page	509
Page Count	10
File Format	PDF
ISSN	14350211
Journal	Journal of Wood Science
Volume Number	61
Issue Number	5
e-ISSN	16114663
Language	English
Publisher	Springer Japan
Publisher Date	2015-08-05
Publisher Place	Tokyo
Access Restriction	Subscribed
Subject Keyword	Wood-based board Durability Deterioration Outdoor exposure Accelerated aging test Wood Science & Technology Materials Science Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Biomaterials Forestry

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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