NDLI: Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation

Content Provider	Springer Nature Link
Author	Rebhan, B. Tollabimazraeh, S. Hesser, G. Dragoi, V.
Copyright Year	2015
Abstract	Metal wafer bonding is a well-established technology in the semiconductor industry. This technology gains more and more importance due to increasing market demands, particularly for three-dimensional integrated circuits and integration of complementary metal oxide semiconductor and microelectromechanical systems devices used in consumer electronics. Cu–Cu wafer bonding at low temperature is a very attractive process which can be used for both mechanical joints and electrical interconnects in wafer-level processes. In order to facilitate a permanent Cu–Cu bond at low temperature—in contrast to a typical ~400 °C Cu–Cu bonding temperature—the effect of material properties and bonding parameters has to be understood well. Therefore a comprehensive characterization including both, namely surface and interface analysis before and after wafer bonding of non-patterned Cu layers, respectively, is required in order to optimize the Cu–Cu metal wafer bonding process. Low temperature Cu–Cu bonding, namely ≤200 °C, of ~500 nm sputter-deposited Cu films was demonstrated and characterized. Selected analytical methods, such as transmission electron microscopy, Auger electron spectroscopy and electron backscatter diffraction, and their corresponding specimen preparation techniques for microstructure and elemental composition evaluation are introduced. Experimental results of surfaces and interfaces investigation (materials properties with high impact on their bonding behavior), such as the (i) surface roughness, (ii) Cu native oxide, (iii) Cu (surface) purity and (iv) Cu grain size, as well as the influence of the (vi) bonding temperature are presented.
Starting Page	1003
Ending Page	1013
Page Count	11
File Format	PDF
ISSN	09467076
Journal	Microsystem Technologies
Volume Number	21
Issue Number	5
e-ISSN	14321858
Language	English
Publisher	Springer Berlin Heidelberg
Publisher Date	2015-02-11
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Electronics and Microelectronics, Instrumentation Nanotechnology Mechanical Engineering
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Hardware and Architecture

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