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| Content Provider | Springer Nature Link |
|---|---|
| Author | Xie, Lei Ziegmann, Gerhard |
| Copyright Year | 2009 |
| Abstract | As a hot fabrication technology for micro scale parts, micro injection molding is receiving increasing market attention. Improving mechanical properties of micro parts should be an important issue in the micro injection molding process. The relation between weld line strength in micro injection molding parts and processing parameters is investigated. A visual mold with variotherm unit is designed and constructed, in which the micro tensile specimen with weld line are prepared. Polypropylene (PP) is used as the research material in this study, and six processing parameters were chosen as investigating factors, which were melt temperature, mold temperature, injection pressure, packing pressure, ejection temperature and injection speed. In order to achieve optimized processing parameters and their order of significance, Taguchi experiment method was applied in this presented study. The prediction formulation of the strength of micro weld line was built up by multiple regression analysis based on Chebyshev orthogonal polynomial. The results showed the influencing significance order of parameters from strong to week separately are mold temperature, melt temperature, injection speed, ejection temperature, packing pressure and injection pressure. And the tolerance of micro weld line prediction formulation was found to be lower than 21% through confirmation experiments. |
| Starting Page | 1427 |
| Ending Page | 1435 |
| Page Count | 9 |
| File Format | |
| ISSN | 09467076 |
| Journal | Microsystem Technologies |
| Volume Number | 15 |
| Issue Number | 9 |
| e-ISSN | 14321858 |
| Language | English |
| Publisher | Springer-Verlag |
| Publisher Date | 2009-07-24 |
| Publisher Place | Berlin, Heidelberg |
| Access Restriction | One Nation One Subscription (ONOS) |
| Subject Keyword | Electronics and Microelectronics, Instrumentation Mechanical Engineering Nanotechnology |
| Content Type | Text |
| Resource Type | Article |
| Subject | Nanoscience and Nanotechnology Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Hardware and Architecture |
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