NDLI: Parametric study of flip-chip packaging for an MEMS device with diaphragm

Content Provider	Springer Nature Link
Author	Chuang, Cheng Hsin Li, Wen Hui Lee, Shin Li
Copyright Year	2010
Abstract	A backside-etched silicon chip with a polysilicon diaphragm flip-chip attached on a printed wiring board and globally bumped on a FR4 printed circuit board was investigated through a finite element analysis for determining three key parameters of flip-chip chip size packaging, namely, the size of solder bump, and the thickness of the printed wiring board with/without U8437-3 underfill. Four kinds of thermal-induced stresses and deformations in the diaphragm, solder bump, and printed wiring board were evaluated for the parametric study. As the simulation results show, the thermal-induced stresses in the diaphragm and solder bump can be reduced effectively if the printed wiring board is thinner. However, the printed wiring board is still required to be sufficiently thick to prevent warping. In addition, the underfill material also can reduce the induced stress occurring at the interface between the solder joint and the chip and improve reliability. In general, the parametric study can provide a basis for the flip chip package of a MEMS device with a diaphragm, such as a MEMS microphone, MEMS pressure sensor, etc.
Starting Page	669
Ending Page	675
Page Count	7
File Format	PDF
ISSN	09467076
Journal	Microsystem Technologies
Volume Number	17
Issue Number	4
e-ISSN	14321858
Language	English
Publisher	Springer-Verlag
Publisher Date	2010-12-24
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Electronics and Microelectronics, Instrumentation Mechanical Engineering Nanotechnology
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Hardware and Architecture

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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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