NDLI: Improvement of capillary electrophoresis property for microchannels fabricated by deep X-ray lithography

Content Provider	Springer Nature Link
Author	Utsumi, Y. Ozaki, M. Terabe, S. Hattori, T.
Copyright Year	2005
Abstract	We fabricated the electrophoresis microchips using the UV polymerization technique. We employed plastic substrates that were suitable for rapid prototyping instead of glass and quartz. A thick UV negative photo resist was used to form molds and poly-dimethylsilozane (PDMS) was polymerized by a thermal curing process on the mold to obtain replica microchips. Electroosmotic flow (EOF) was measured to evaluate the surface. Characteristic differences between UV-fabricated and SR-fabricated microchips were evaluated by electro osmotic flow (EOF) measurement. It was observed that microchannels fabricated by SR lithography show constant peak heights and FWHMs. We also investigated the effect of the change of the channel width along the EOF direction. It is demonstrated that broadening width channel significantly restricts the sample diffusion towards the EOF direction and leads to the high resolusion separation on the PDMS microchips. Thus the advantage of the application of SR lithography to the mold fabrication is also demonstrated.
Starting Page	235
Ending Page	239
Page Count	5
File Format	PDF
ISSN	09467076
Journal	Microsystem Technologies
Volume Number	11
Issue Number	4-5
e-ISSN	14321858
Language	English
Publisher	Springer-Verlag
Publisher Date	2005-01-01
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Micro capillary electrophoresis PDMS microfluids Synchrotron radiation X-ray lithography Nanotechnology Memory Structures Information Storage and Retrieval Operating Procedures, Materials Treatment Electronics and Microelectronics, Instrumentation
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Hardware and Architecture

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