NDLI: A flexible polyimide cable for implantable neural probe arrays

Content Provider	Springer Nature Link
Author	Cheng, Ming Yuan Park, Woo Tae Yu, Aibin Xue, Rui Feng Tan, Kwan Ling Yu, Daquan Lee, Sang Hyun Gan, Chee Lip Je, Minkyu
Copyright Year	2012
Abstract	A flexible polyimide cable developed for implantable neural probe array application is presented. The flexible cable is used to connect two implantable platforms—one in direct touch with the brain containing a neural probe array and its interface IC, and the other on the skull including a wireless link IC, a coil and an antenna for power and data transfer through the transcutaneous link. The cable needs to be highly flexible to minimize post-insertion injury caused by the probe array in the presence of brain micro-motion. Polyimide is used to form a flexible substrate and an insulator layer of the cable. For the advanced neural recording system, a large amount of neural recording data has to be communicated between the two platforms through the flexible cable. High-rate data transmission performance of the fabricated flexible cable is characterized and discussed. The measured insertion loss (IL) of the flexible cable is less than 3 dB and the isolation between two adjacent interconnects is better than 17 dB up to 2 GHz. The data transmission through the flexible cable is verified to be highly reliable at 100 Mbps. For surgical manipulation and long term implantation of the neural probe microsystem, the flexible cable needs to have excellent mechanical strength and resistance to fatigue. The mechanical characteristics and fatigue strength of the flexible cable are also measured and discussed. The measured maximum tensile stress and strain of the flexible cable before failure are 251.2 ± 7.1 MPa (14.35 ± 0.3 N) and 4.16 ± 0.11 %, respectively. The Young’s modulus of the fabricated flexible cable is 8.21 GPa. From the fatigue strength testing, the measured resistance change of the flexible cable’s interconnect is less than 4.8 % after 250,000 cycles of cyclic mechanical stretch.
Starting Page	1111
Ending Page	1118
Page Count	8
File Format	PDF
ISSN	09467076
Journal	Microsystem Technologies
Volume Number	19
Issue Number	8
e-ISSN	14321858
Language	English
Publisher	Springer Berlin Heidelberg
Publisher Date	2012-12-05
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Electronics and Microelectronics, Instrumentation Nanotechnology Mechanical Engineering
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Hardware and Architecture

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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