NDLI: Shear thickening and shear-induced agglomeration of chemical mechanical polishing slurries using electrolytes

Content Provider	Springer Nature Link
Author	Crawford, Nathan C. Yohe, Benjamin Kim, S. Williams, R. Boldridge, David Liberatore, Matthew W.
Copyright Year	2013
Abstract	Chemical mechanical polishing is a fundamental technology used in the semiconductor manufacturing industry to polish and planarize a wide range of materials for the fabrication of microelectronic devices. During the high-shear (∼1,000,000 s−1) polishing process, it is hypothesized that individual slurry particles are driven together to form large agglomerates (≥0.5 µm). These agglomerates are believed to trigger a shear-induced thickening effect and cause defects during polishing. We examined how the addition of various monovalent salts (CsCl, KCl, LiCl, and NaCl) and electrostatic stabilizing bases (KOH, NaOH, or CsOH) influenced the slurry’s thickening behavior. Overall, as the added salt concentration was increased from 0.02 to 0.15 M, the shear rate at which the slurry thickened (i.e., the critical shear rate) decreased. Slurries with added CsCl, NaCl, and LiCl thickened at comparable shear rates (∼20,000–70,000 s−1) and, in general, followed ion hydration theory (poorly hydrated ions caused the slurry to thicken at lower shear rates). However, slurries with added KCl portrayed thickening behavior at higher critical shear rates (∼35,000–100,000 s−1) than other chloride salts. Also, slurries stabilized with CsOH thickened at higher shear rates (∼90,000–140,000 s−1), regardless of the added salt cation or concentration, than the slurries with KOH or NaOH. The NaOH-stabilized slurries displayed thickening at the lowest shear rates (∼20,000 s−1). The thickening dependence on slurry base cation indicates the existence of additional close-range structure forces that are not predicted by the Derjaguin–Landau–Verwey–Overbeek colloidal stability theory.
Starting Page	499
Ending Page	513
Page Count	15
File Format	PDF
ISSN	00354511
Journal	Rheologica Acta
Volume Number	52
Issue Number	5
e-ISSN	14351528
Language	English
Publisher	Springer-Verlag
Publisher Date	2013-06-04
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Chemical mechanical polishing High shear Rheology Shear thickening Electrolyte Fumed silica Characterization and Evaluation of Materials Polymer Sciences Soft and Granular Matter, Complex Fluids and Microfluidics Mechanical Engineering Food Science
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Condensed Matter Physics Materials Science

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