NDLI: Self-assembly of a linear mesoscale tetramer with electrical connectivity

Content Provider	Springer Nature Link
Author	Reylds, K. Murray, É. O’Riordan, A. Redmond, G.
Copyright Year	2005
Abstract	Capillary interaction-based self-assembly of block-shaped mesoscale components into an electrically interconnected 1-D tetramer is reported. Low melting point solder droplets, selectively patterned on the faces of the blocks, were employed to drive the sequential alignment, registration, linking and electrical interconnection of each block. The solder patterns were designed so that successful assembly would only occur when the solder patterns on one block face were correctly aligned with those on the face of an adjacent block. For assembly, the blocks were agitated in a flask containing KBr solution. At 60 °C the solder was molten, and collisions between blocks enabled the solder menisci to easily interact. To minimize interfacial free energy, the menisci coalesced and quickly drove the interacting blocks to form a stable, registered and aligned assembly. When agitation was terminated and the solution cooled, the self-aligned, linear tetrameric arrangement of blocks was permanently captured by solder solidification, a process that provided good mechanical bonding and electrical interconnection between each block.
Starting Page	23
Ending Page	26
Page Count	4
File Format	PDF
ISSN	09478396
Journal	Applied Physics A
Volume Number	83
Issue Number	1
e-ISSN	14320630
Language	English
Publisher	Springer-Verlag
Publisher Date	2006-01-04
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Content Type	Text
Resource Type	Article
Subject	Chemistry Materials Science

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