NDLI: Modeling and investigation on wafer shape in wafer rotational grinding method

Content Provider	Springer Nature Link
Author	Tang, Keyan Kang, Renke Guo, Dongming Song, Li
Copyright Year	2012
Abstract	With the fast development of the integrated circuits, the size of the wafer is getting larger and the demand for the wafer shape and flatness has become higher and higher. There are many factors which could influence the wafer shape. So in this paper based on the rotational coordinates method, a theoretical model of the ground wafer shape in wafer rotational grinding is firstly developed, in which the main factors were considered, including parameters of the dressing vacuum chuck and the wafer grinding, etc. Secondly, the simulation system was developed by Visual C++ and OpenGL according to the model, by which the simulation results of wafer shape could be made and the relationship between the wafer shape and parameters can be gotten. Finally, the experiments of wafer grinding were carried out on an ultra-precision grinder (VG401MKII), and the developed model is verified to be correct by comparing the experiment results and simulation results. The research indicates the wafer shape and flatness can be predicted exactly, and it is quite significant to choose the reasonable parameters to effectively control the wafer shape in the wafer rotational grinding. The total thickness variation can be controlled within 1 nm if the parameters are chosen reasonably.
Starting Page	707
Ending Page	714
Page Count	8
File Format	PDF
ISSN	02683768
Journal	The International Journal of Advanced Manufacturing Technology
Volume Number	64
Issue Number	5-8
e-ISSN	14333015
Language	English
Publisher	Springer-Verlag
Publisher Date	2012-03-27
Publisher Place	London
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Silicon wafer Ultra-precision grinding Simulation Wafer shape Rotational grinding Industrial and Production Engineering Production/Logistics/Supply Chain Mechanical Engineering Computer-Aided Engineering (CAD, CAE) and Design
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Mechanical Engineering Computer Science Applications Software

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