NDLI: Innovative chemical mechanical polish design and experiments

Content Provider	Springer Nature Link
Author	Tsai, Nan Chyuan Huang, Sheng Ming Lin, Chih Che
Copyright Year	2014
Abstract	An innovative design for intelligent chemical mechanical polishing (CMP) control system is proposed and verified by experiments. Online measurement and real-time feedback are integrated to eliminate the shortcomings of traditional approaches, e.g., the batch-to-batch discrepancy of required polishing time, over consumption of chemical slurry, and non-uniformity across the wafer. The major advantage of the proposed method is that the finish of local surface roughness can be consistent, no matter where the inner-ring region or outer-ring region is concerned. Secondly, it is able to eliminate the edge effect: the interfacial-induced stress near the wafer edge is generally much higher than that near the wafer center. At last, by using the proposed intelligent chemical mechanical polishing strategy, the quality of the finished goods certainly upgraded.
Starting Page	853
Ending Page	864
Page Count	12
File Format	PDF
ISSN	02683768
Journal	The International Journal of Advanced Manufacturing Technology
Volume Number	72
Issue Number	5-8
e-ISSN	14333015
Language	English
Publisher	Springer London
Publisher Date	2014-02-27
Publisher Place	London
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Chemical mechanical polishing Active magnetic actuator Online measurement Industrial and Production Engineering Production/Logistics/Supply Chain Mechanical Engineering Computer-Aided Engineering (CAD, CAE) and Design
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Mechanical Engineering Computer Science Applications Software

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