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| Content Provider | Springer Nature Link |
|---|---|
| Author | Ko, Tae Jo Kim, Hee Sool |
| Copyright Year | 2007 |
| Abstract | Micro-end-milling can potentially create desired 3D free-form surface features on silicon using ductile machining technology. A number of technological barriers must be overcome for micro-end-milling to be applied in the cutting of single crystal silicon. To produce smooth surfaces on brittle materials, such as silicon, it is important that the material be machined in the ductile mode. A major limitation of machining brittle materials is that the process of removing the material can generate subsurface damage. We have carried out an experimental study to find the optimum cutting conditions for obtaining ductile regime machining using a micromilling machine. The ductile and brittle regimes in the machining of silicon using diamond-coated end mills were demonstrated by machining grooves. The force ratio, Ft/Fc, was used to determine the milling performance on silicon. The experimental data show that the dominant ductile cutting mode was achieved when Ft/Fc > 1.0. |
| Starting Page | 85 |
| Ending Page | 91 |
| Page Count | 7 |
| File Format | |
| ISSN | 02683768 |
| Journal | The International Journal of Advanced Manufacturing Technology |
| Volume Number | 39 |
| Issue Number | 1-2 |
| e-ISSN | 14333015 |
| Language | English |
| Publisher | Springer-Verlag |
| Publisher Date | 2007-09-22 |
| Publisher Place | London |
| Access Restriction | One Nation One Subscription (ONOS) |
| Subject Keyword | Micro-end-milling Ductile and brittle cutting mode Force ratio Computer-Aided Engineering (CAD, CAE) and Design Mechanical Engineering Production/Logistics Industrial and Production Engineering |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Control and Systems Engineering Mechanical Engineering Computer Science Applications Software |
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