NDLI: Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness

Content Provider	Springer Nature Link
Author	Wu, Chongjun Li, Beizhi Yang, Jianguo Liang, Steven Y.
Copyright Year	2016
Abstract	Grinding of brittle materials is characterized by a complex removal mechanism of both ductile and brittle removal. Therefore, the traditional force models, which are mainly targeted to metallic materials, cannot be fully applied to the force prediction of brittle materials. This paper will propose a new grinding force model for brittle materials considering co-existing of ductile removal force and brittle removal force. The ductile removal force is mainly composed of rubbing force, ploughing force, and chipping force. However, the brittle removal force is more related to rubbing force and fracture chipping force. The proportional coefficient of ductile removal and crack size will be modeled through a series of experiments under different wheel speed and undeformed chip thickness. The working status for a single grit was separated based on the Hertz Theory and chip thickness modeling of Rayleigh probability density function. Grinding experiments have been undertaken by using a high speed diamond grinder on Silicon Carbide, and the results was compared to the force model predictions for validation. The predictive force model shows a reasonable agreement quantitatively with the experimental force data.
Starting Page	1967
Ending Page	1975
Page Count	9
File Format	PDF
ISSN	02683768
Journal	The International Journal of Advanced Manufacturing Technology
Volume Number	87
Issue Number	5-8
e-ISSN	14333015
Language	English
Publisher	Springer London
Publisher Date	2016-03-14
Publisher Place	London
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Grinding force Brittle materials Ductile grinding High speed grinding Industrial and Production Engineering Production Mechanical Engineering Computer-Aided Engineering (CAD, CAE) and Design
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Mechanical Engineering Computer Science Applications Software

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