NDLI: Material removal mechanism of cluster magnetorheological effect in plane polishing

Content Provider	Springer Nature Link
Author	Pan, Jisheng Yan, Qiusheng
Copyright Year	2015
Abstract	A cluster magnetorheological (MR) plane polishing based on a combination of magnetorheological finishing (MRF) and cluster mechanism (arrange in a regular array) has been developed for large planar optical workpiece. In this paper, the polishing pressure of an individual MR micro-grinding head on workpieces was investigated, and the mathematical model for cluster MR plane polishing was established based on the Preston equation and the properties of the workpiece material. An arc-shaped polishing belt was processed on monocrystalline 6H-SiC and Si wafer by the cluster MR polishing apparatus which polishing disk inlaid with cylindrical flat bottom magnetic pole arrange in the same direction regularly and monocyclically. The profile of arc polishing belt’s cross section and the surface morphology were observed and analysed to verify the obtained model. The abrasives with different size were found to have an equal effect on the processed surface because of the accommodated-sinking effect of the polishing pad constituted by the cluster MR micro-grinding head. It was found that the monocrystalline 6H-SiC and Si wafer were polished in a plastic mode with a smooth, damage-free surface.
Starting Page	2017
Ending Page	2026
Page Count	10
File Format	PDF
ISSN	02683768
Journal	The International Journal of Advanced Manufacturing Technology
Volume Number	81
Issue Number	9-12
e-ISSN	14333015
Language	English
Publisher	Springer London
Publisher Date	2015-06-03
Publisher Place	London
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Cluster MR effect Material removal mechanism Polishing pressure Semi-fixed abrasive Industrial and Production Engineering Production Mechanical Engineering Computer-Aided Engineering (CAD, CAE) and Design
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Mechanical Engineering Computer Science Applications Software

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