NDLI: The reliability prediction of electronic packages

Content Provider	Springer Nature Link
Author	Gnanasambandam, Nathan Primavera, Anthony Srihari, K.
Copyright Year	2005
Abstract	The exponential growth of the electronics packaging industry has fueled the availability of a variety of area array packages. The reliability of these packages, as characterized by their capacity to withstand the IPC- (formerly Institute of Interconnecting and Packaging Electronic Circuits) prescribed swings in temperature, differentiates one from the other. With design cycles shrinking and competition surging, the capability to make instant package selection decisions by leveraging prior empirical data could pose as a potential alternative for exhaustive experimentation. By employing expert systems techniques, this research developed suitable models that accurately depict field conditions in order to assist in delineating trends in package reliability data.The fatigue behavior of the solder joints subjected to accelerated thermal cycling is often used as an indicator of the reliability of electronic packages in field conditions. Design for reliability (DFR) could be pursued if the thermal fatigue behavior can be predicted in the design phase of a product. The finite element method (FEM) and accelerated testing such as air-to-air thermal cycling (AATC) have been used extensively to study second-level package reliability. Factors like incorrect assumptions or unknown material properties involved in the development of the FEM models are the cause of deviations between actual and predicted values The mathematical complexity and the time needed for model development further aggravate the situation.The focal point of this research was to develop a generic method that could be used to predict the second-level solder joint reliability of area array packages from the analysis of empirical data. While package characteristics play an important role in identifying the similarities between various subsets of packages, the role of assembly parameters is crucial in terms of their impact on reliability. Weights, in terms of the parameters’ impact on reliability, are computed by examining each individual experiment. Based upon identified trends and the separation of qualitative and quantitative impact of the contributing parameters, regression models may be developed to capture the second-level reliability behavior of the package. These models make it possible to predict reliability and potentially save time and resources for an end-user.
Starting Page	381
Ending Page	391
Page Count	11
File Format	PDF
ISSN	02683768
Journal	The International Journal of Advanced Manufacturing Technology
Volume Number	27
Issue Number	3-4
e-ISSN	14333015
Language	English
Publisher	Springer-Verlag
Publisher Date	2005-05-25
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Accelerated testing Electronics manufacturing Expert system Knowledge-based systems Reliability prediction Computer-Aided Engineering (CAD, CAE) and Design Mechanical Engineering Production/Logistics Industrial and Production Engineering
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Mechanical Engineering Computer Science Applications Software

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Robustness evaluation using highly accelerated life testing

Applying knowledge-based engineering to traditional manufacturing design

Design of parts and manufacturing systems for reliability and maintainability

Creating machinable textures for CAD/CAM systems

An expert system approach for quality assurance auditing

A knowledge-based approach for the task implementation in mechanical product design

A knowledge-based parametric design system for drawing dies

Knowledge-intensive support for product design with an ontology-based approach

Reliability Optimisation of Flexible Manufacturing Systems with Spare Tooling

The reliability prediction of electronic packages – an expert systems approach

Similar Documents

Robustness evaluation using highly accelerated life testing

Applying knowledge-based engineering to traditional manufacturing design

Design of parts and manufacturing systems for reliability and maintainability

Creating machinable textures for CAD/CAM systems

An expert system approach for quality assurance auditing

A knowledge-based approach for the task implementation in mechanical product design

A knowledge-based parametric design system for drawing dies

Knowledge-intensive support for product design with an ontology-based approach

Reliability Optimisation of Flexible Manufacturing Systems with Spare Tooling

The reliability prediction of electronic packages – an expert systems approach