NDLI: United States Patent ( 19 ) to et al . ( 54 ) EPOXY RESIN COMPOSITION FOR

Content Provider	Semantic Scholar
Author	Ito, Hiromi Takahashi, Ichiro Kanegae, Hirozoh
Copyright Year	2017
Abstract	Disclosed herein is an epoxy resin composition for seal ing a semiconductor, which contains a flexibilizer, epoxy resin, a hardener, a hardening accelerator, a filler, a nold releasing agent, a colorant and a finishing agent. The flexibilizer is prepared from silicone contain ing hydroxyphenyl groups on ends of and/or in its molecules, which is formed of a copolymer of dena tured silicone oil A having hydroxyphenyl groups, de natured silicone oil B having epoxy groups and/or bi functional epoxy resin having epoxy groups on both ends.
File Format	PDF HTM / HTML
Alternate Webpage(s)	https://patentimages.storage.googleapis.com/e5/81/5e/830f7a51bf7756/US5114994.pdf
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Patent

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