Loading...
Please wait, while we are loading the content...
Similar Documents
Study in IC chip failure during pick-up process by using experimental and finite element methods
| Content Provider | Semantic Scholar |
|---|---|
| Author | Cheng, Tung-Hua Du, Chen-Chung Tseng, Ching-Huan |
| Copyright Year | 2006 |
| Abstract | Abstract Stress contours of an IC chip and the displacement contours of the adhesive between an IC chip and blue tape in the pick-up integrated circuit (IC) chip process are obtained using experimental and finite element methods. The physical and mechanical properties of the material used in FEM are determined by pre-experimental tests. Some factors that importantly influence the failure of a pick-up IC chip during the pick-up IC chip process are proposed. The pre-experimental material properties are manifest in the practical behavior of material, so the post-experimental results are approximately consistent with the FEM results. Post-experiments further demonstrated that the findings of this study can be used to increase the success rate of the pick-up IC chip process. |
| Starting Page | 407 |
| Ending Page | 416 |
| Page Count | 10 |
| File Format | PDF HTM / HTML |
| DOI | 10.1016/j.jmatprotec.2005.11.002 |
| Volume Number | 172 |
| Alternate Webpage(s) | https://ir.nctu.edu.tw/bitstream/11536/12493/1/000236294600013.pdf |
| Alternate Webpage(s) | https://doi.org/10.1016/j.jmatprotec.2005.11.002 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
