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Thermal Interface Materal for Integrated Circuitpackage and Method of Making the Same Background of the Disclosure
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2017 |
| Abstract | (72) Inventors: Sam Ziqun ZHAO, Irvine, CA (US); Arpit Mittal, Irvine, CA (US); Rezaur In an embodiment, a thermal interface material (TIM) is Rahman Khan, Irvine, CA (US) provided. The TIM comprises first and a second layers of a first transition metal, and a third layer including a plurality of (21) Appl. No.: 13/921,594 carbon nanotubes Supported in a flexible polymer matrix and a second transition metal courled to sidewalls of carbon (22) Filed: Jun. 19, 2013 nanotubes. The first and SN metal layers are in contact |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/f4/c6/94/ba22b8df361bfa/US20140374897A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |