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Benzocyclobutene (BCB) Dielectrics for the High Density, Thin Film Multichip Modules Fabrication of
| Content Provider | Semantic Scholar |
|---|---|
| Author | Burdeaux, David Townsend, Paul H. Carr, Joseph Garrou, Philip E. |
| Copyright Year | 1990 |
| Abstract | A new class of organic dielectrics, benzocyclobutenes, 1, are described and their application to the fabrication of thin film multichip modules is detailed. Key properties for 3, a siloxy containing BCB derivative include low dielectric constant (2.7), low loss (0.008 at 1 MHz), low water absorption (0.25% after 24 h water boil) and high degree of planarization (>90% from one layer coverage). All other properties meet the requirements necessary for fabrication of thin film MCM structures. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://page-one.springer.com/pdf/preview/10.1007/BF02662825 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
