Effect of Cooling Rate on Microstructure and Mechanical Properties of Eutectic SnAg Solder Joints with and without Intentionally Incorporated Cu 6 Sn 5 Reinforcements

Content Provider	Semantic Scholar
Author	Subramanian, K. N. Lucas, James P. Bieler, Thomas R.
Abstract	Over the past decade, there has been significant interest in eliminating lead in solders because of its hazardous nature to life and the environment. Certain lead-free solders such as eutectic Sn-Ag and Sn3.5Ag-.5Cu1 solders have emerged after extensive considerations as likely candidates to replace lead containing solder joints. One of their advantages is that they melt at temperatures near 221°C instead of at 183°C like the eutectic 63Sn-37Pb alloy does. This property has led to higher service temperature applications. Other important properties are strength and ductility. The strength and ductility of a solder joint are very important for in-service applications. Solder joints need to demonstrate a good balance between strength and ductility in order to withstand thermal, mechanical, and thermomechanical loading. In addition to compositional variations, other avenues that are pursued for improving mechanical properties include a composite approach.2–5 One such variation is incorporation of intermetallic reinforcements by insitu methods.6,7 Such reinforcements can alter the properties of the solder joint, and can also alter the solidification structure by providing additional heterogeneous nucleation sites for dendrites. The effect of the solidification structure on the JEFF SIGELKO, S. CHOI, K.N. SUBRAMANIAN, JAMES P. LUCAS, and T.R. BIELER
File Format	PDF HTM / HTML
Alternate Webpage(s)	https://page-one.springer.com/pdf/preview/10.1007/s11664-999-0155-2
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article