An experimental investigation on a novel high-performance integrated heat pipe–heat sink for high-flux chip cooling

Content Provider	Semantic Scholar
Author	Yang, Hae Woong
Copyright Year	2008
Abstract	Abstract The investigation of high-performance cooling device is highly desired. Heat pipe is a promising candidate to meet the thermal management challenges in the future. In the current investigation, a novel integrated heat pipe–heat sink is presented with a new design of condenser and wick structure. Experimental investigation on its thermal performance and pressure drop is conducted. For a total power of 420 W, the thermal resistance is 0.118 K/W and the maximum temperature difference reaches 50 K when the air flow rate is 71 m 3 /h (about 2.9 m/s frontal velocity) with pressure drop of 30 Pa.
Starting Page	433
Ending Page	439
Page Count	7
File Format	PDF HTM / HTML
DOI	10.1016/j.applthermaleng.2007.05.010
Alternate Webpage(s)	http://nht.xjtu.edu.cn/paper/en/2008203.pdf
Alternate Webpage(s)	https://doi.org/10.1016/j.applthermaleng.2007.05.010
Volume Number	28
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article