NDLI: Crystalline Silicon Tilting Mirrors for Optical Cross-Connect Switches

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Crystalline Silicon Tilting Mirrors for Optical Cross-Connect Switches

Content Provider	Semantic Scholar
Author	Greywall, Dennis S. Busch, Paul Pardo, Flavio Carr, Dustin W. Bogart, Gregory R. Soh, Hyongsok Tom
Copyright Year	2001
Abstract	This paper discusses a two-piece approach for fabricating two-dimensional (2-D) arrays of tilting MEMS mirrors with application in very-large optical cross-connect switches. In the new process, a two-sided etching of silicon-on-insulator (SOI) wafers is used to create crystalline mirrors on a first wafer that is later aligned and bonded to a separate wafer containing the activation electrodes, traces, and bond pads. The approach allows a very close spacing of mirror elements and a very simple design for the mechanical structures, and also greatly simplifies wire routing. [1010]
File Format	PDF HTM / HTML
Alternate Webpage(s)	http://engineering.ucsb.edu/sohlab/pdf/crystalline_silicon.pdf
Alternate Webpage(s)	http://www.engr.ucsb.edu/sohlab/pdf/crystalline_silicon.pdf
Alternate Webpage(s)	https://web.stanford.edu/group/sohlab/cgi-bin/wordpress/wp-content/uploads/2017/10/Crystalline-Silicon-Tilting-Mirrors-for-Optical-Cross-Connect-Switches.pdf
Language	English
Access Restriction	Open
Subject Keyword	Alignment Digital cross connect system Medication Event Monitoring System Microelectromechanical systems Network switch Optical cross-connect Oral Wafer Routing (electronic design automation) Silicon on insulator Switch Device Component Topological insulator Tracing (software) Wafer (electronics) electrode
Content Type	Text
Resource Type	Article

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