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Multi-Layer Inkjet Printed Contacts to Si
| Content Provider | Semantic Scholar |
|---|---|
| Author | Curtis, Calvin J. Hest, M. Van Miedaner, Alexander Kaydanova, Tatiana Smith, L. Ginley, David S. |
| Copyright Year | 2005 |
| Abstract | Ag, Cu, and Ni metallizations were inkjet printed with near vacuum deposition quality. The approach developed can be easily extended to other conductors such as Pt, Pd, Au, etc. Thick highly conducting lines of Ag and Cu demonstrating good adhesion to glass, Si, and printed circuit board (PCB) have been printed at 100-200 deg C in air and N2 respectively. Ag grids were inkjet-printed on Si solar cells and fired through the silicon nitride AR layer at 850 deg C, resulting in 8% cells. Next generation inks, including an ink that etches silicon nitride, have now been developed. Multi-layer inkjet printing of the etching ink followed by Ag ink produced contacts under milder conditions and gave solar cells with efficiencies as high as 12%. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://www.nrel.gov/docs/fy06osti/38943.pdf |
| Alternate Webpage(s) | http://www.nrel.gov/docs/fy06osti/38943.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
