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SEM and EDX study of intermetallics in a copper-tin system and the oxidation behaviour of tin
| Content Provider | Semantic Scholar |
|---|---|
| Author | Alam, Syed Nasimul Mishra, Manas Kumar |
| Copyright Year | 2012 |
| Abstract | This study is mainly based on the intermetallics that are formed in the CuSn system. The aim was to understand the solidification of Cu-Sn alloys, the various intermetallics formed and their morphology. The Pb-Sn solders are being replaced by the Sn-Cu, Sn-Ag or Sn-AgCu alloys due to the harmful effects of Pb in nature. Here the intermetallics formed between Cu-Sn during solidification of the molten solder on the Cu electrical contacts is also studied. The intermetallics are brittle in nature and this leads to fracture of the solder. In order to understand the Sn-Cu or Sn-Ag-Cu lead free solder alloys it is essential to is understand the solidification of the molten alloys. This is why a few compositions of Cu-Sn alloy are selected and the various intermetallics formed during the solidification of the molten Cu-Sn alloys are analyzed. Scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDX) have been used to analyze the various samples. Investigations have been done to find out the intermetallics that are formed when the molten alloy solidifies. The oxidation behavior of Sn was also studied. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://microscopy-analysis.com/sites/default/files/2013_January_Alam.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
