NDLI: Physical, Microstructural and Sensory Characteristics of Extruded and Microwave-expanded Snacks Added with Dehydrated Squash

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Physical, Microstructural and Sensory Characteristics of Extruded and Microwave-expanded Snacks Added with Dehydrated Squash

Content Provider	Semantic Scholar
Author	Delgado-Nieblas, Carlos Iván Zazueta-Morales, José De Jesús Aguilar-Palazuelos, Ernesto Jacobo-Valenzuela, Noelia Aguirre-Tostado, Francisco S. Carrillo-López, Armando Ruiz-Armenta, Xóchitl Ariadna Telis-Romero, Javier
Copyright Year	2018
Abstract	The objective of this work was to study the effects of the extrusion temperature (T, 93-141 °C), feed moisture content (FMC, 21.27-34.73%), and dehydrated squash content (DS, 0.43-15.57%) on physical, microstructural and sensory characteristics of microwave-expanded snack foods (SF) formulated adding dehydrated squash to a base blend of corn starch-yellow corn. A second order rotatable central composite design and the response surface methodology for data analysis were used. The T and FMC showed a greater effect (P < 0.05) on specific volume and moisture of pellets, whereas FMC and DS showed a greater effect on Chroma (C) and Hue (H) color parameters. The microstructural properties of the snacks evaluated with the Rapid Visco-Analyzer (RVA), Differential scanning calorimetry (DSC) and X-ray diffraction (XRD) were related mainly to the starch gelatinization. Also, the sensory acceptability of snacks added with DS reached almost 79%. The results indicate that it is possible to elaborate SF with acceptable physical and sensory characteristics by adding DS to a base blend.
Starting Page	805
Ending Page	821
Page Count	17
File Format	PDF HTM / HTML
DOI	10.24275/uam/izt/dcbi/revmexingquim/2018v17n3/Delgado
Volume Number	17
Alternate Webpage(s)	http://www.rmiq.org/ojs311/index.php/rmiq/article/download/6/63
Alternate Webpage(s)	https://doi.org/10.24275/uam%2Fizt%2Fdcbi%2Frevmexingquim%2F2018v17n3%2FDelgado
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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