NDLI: Low-temperature sintering of highly conductive silver ink for flexible electronics

Content Provider	Semantic Scholar
Author	Bhat, Kiesar Sideeq Ahmad, Rafiq Wang, Yousheng Hahn, Yoon-Bong
Copyright Year	2016
Abstract	Herein, we report a naive synthesis procedure for the development of a durable, particle-free, low-temperature sintered silver organic precursor (SOP) ink using low boiling point mild organic complexing ligands. The synthesized inks were printed on variable substrates such as glass, PET and PI using spin-coating and nozzle-jet printing methods. The as-printed films were sintered at low temperatures (<90 °C) to give smooth silver films with excellent adhesion and high conductivity. The SOP spin-coated film on glass annealed at 60 °C and the nozzle-jet printed film on PET sintered at 75 °C yielded high conductivities of 1.07 × 106 S m−1 and 2.74 × 106 S m−1, respectively, which are only one-order-of-magnitude lower than bulk silver (∼107 S m−1). The silver films connected with light-emitting diodes (LEDs) also showed excellent adhesion strength through the bending and twisting test.
Starting Page	8522
Ending Page	8527
Page Count	6
File Format	PDF HTM / HTML
DOI	10.1039/C6TC02751B
Volume Number	4
Alternate Webpage(s)	http://www.rsc.org/suppdata/c6/tc/c6tc02751b/c6tc02751b1.pdf
Alternate Webpage(s)	https://doi.org/10.1039/C6TC02751B
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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