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Electroless palladium plating bath and electroless palladium plating method
Content Provider | Semantic Scholar |
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Author | 구로사카, 세이고 무라스미, 아키히코 유키노리, 오다 이나가와, 히로무 |
Copyright Year | 2006 |
Abstract | At least one type of a palladium compound and a complexing agent selected from at least one member and a hypophosphite, and hypophosphorous acid salt as a reducing agent selected from ammonia and amine compounds, and unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylic acids salts, and unsaturated carboxylic acid plating containing at least one kind of the unsaturated carboxylic acid compound is selected from derivatives of palladium plating bath. Electroless palladium plating baths of the present invention is high in bath stability, and decomposition of the bath hardly occurs, the bath life is longer by comparison to a conventional electroless palladium plating baths. In addition, prolonged use not the effect on the plating film characteristics, it is possible to obtain excellent solder bonding characteristics and wire bonding characteristics. Palladium, the complexing agent, ammonia, amines, hypophosphorous acid, a carboxylic acid, electroless plating, plating bath. |
File Format | PDF HTM / HTML |
Alternate Webpage(s) | https://patentimages.storage.googleapis.com/82/fb/74/5066696982e238/US20090133603A1.pdf |
Language | English |
Access Restriction | Open |
Content Type | Text |
Resource Type | Article |