NDLI: Grain-Boundary Sliding and Its Accommodation at Triple Junctions in Aluminum and Copper Tricrystals

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Grain-Boundary Sliding and Its Accommodation at Triple Junctions in Aluminum and Copper Tricrystals

Content Provider	Semantic Scholar
Author	Okada, Tatsuya Hisazawa, Hiromu Iwasaki, Akihiro Amimoto, Shota Miyaji, Jun Shisawa, Masaki Ueki, Tomoyuki
Copyright Year	2019
Abstract	The objective of the present study was to investigate the suppression of grain-boundary sliding and its accommodation at triple junctions. Tricrystals of pure aluminum and pure copper having ©110a-tilt s = 3, 3, and 9 boundaries were grown. Creep tests were carried out at temperatures above 0.8TM, where TM is the melting point on the absolute temperature scale. In all specimens, boundary sliding occurred only in the 9 boundary. In aluminum tricrystals, sharp folds formed as a result of the suppression of 9 boundary sliding at the triple junction. Slip lines parallel to the trace of the (100) plane were observed in the fold. In copper tricrystals, no fold formed but a wedge crack was initiated at the triple junction and extended along one of the 3 boundaries aligned perpendicularly to the tensile axis. These results suggest that the ease or difficulty of fold formation affects crack formation during creep. [doi:10.2320/matertrans.M2018296]
Starting Page	86
Ending Page	92
Page Count	7
File Format	PDF HTM / HTML
Volume Number	60
Alternate Webpage(s)	https://www.jstage.jst.go.jp/article/matertrans/60/1/60_M2018296/_pdf
Alternate Webpage(s)	https://doi.org/10.2320/matertrans.m2018296
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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