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Graphene Transparent Conductive Electrodes for Next- Generation Microshutter Arrays
| Content Provider | Semantic Scholar |
|---|---|
| Author | Li, Mary Sultana, Mahmooda Hess, Larry A. Poolesville |
| Copyright Year | 2012 |
| Abstract | NASA Tech Briefs, May 2012 and etched all the way through a silicon on insulator (SOI) wafer, which consists of a thin silicon membrane bonded to a thick silicon handle wafer. (2) The metal microwave circuitry on the front of the membrane is patterned and etched. (3) The wafer is then temporarily bonded with wafer wax to a Pyrex wafer, with the SOI side abutting the Pyrex. (4) The silicon handle component of the SOI wafer is subsequently etched away so as to expose the membrane backside. (5) The wafer is flipped over, and metal microwave circuitry is patterned and etched on the membrane backside. Furthermore, cuts in the membrane are made so as to define the individual detector array chips. (6) Silicon frames are micromachined and glued to the silicon membrane. (7) The membranes, which are now attached to the frames, are released from the Pyrex wafer via dissolution of the wafer wax in acetone. This work was done by Ari Brown, WenTing Hsieh, Samuel Moseley, Thomas Stevenson, Kongpop U-Yen, and Edward Wollack of Goddard Space Flight Center. GSC-16202-1 |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/20120009263.pdf |
| Alternate Webpage(s) | https://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/20120009225.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
